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Artificial Plasmonics for VLSI Interconnects Bridging the Gap Between Electronics and Optics (TrueRetail PDF) | 6.56 MB
Title: Artificial Plasmonics for VLSI Interconnects
Author: Soumitra R. Joy;Pinaki Mazumder;
Category: Nonfiction, Science & Nature, Technology, Electronics, Circuits, Computers, Advanced Computing, Programming, Data Modeling & Design, Material Science
Language: English | 307 Pages | ISBN: 9781394289967
Description:
Build the microchips of the future with this revolutionary new information transfer technology
Advancements in high-performance computing have continually demanded for progress in disruptive technological research and innovations. Moore's Law has pushed the Very Large Scale Integration (VLSI) technology to pack MOS devices inside a chip at an exponential rate, thereby surpassing now eight billion transistors per cm2. This has concomitantly fueled the growth of multilayered on-chip interconnects comprising metallic and low dielectric materials.
Artificial Plasmonics for VLSI Interconnects introduces a new method for improving chip performance by harnessing the power of information transfer among chips at terahertz frequency. This revolutionary new electromagnetic wave engineering, called a spoof surface plasmon polariton, adapts the principles of VLSI and terahertz interconnect technology along with the artificial plasmonics to transfer huge quantities of data at vastly improved speeds. It constitutes a potentially decisive contribution to the pursuit of faster and more capacious VLSI chips.
In Artificial Plasmonics for VLSI Interconnects, readers will also find:
[list]
[*]A cutting-edge new approach supported by pioneering research
[*]Detailed discussion of essential components related to the development of THz interconnect technology, including theory, modeling, simulation, and validation
[*]Roadmap to future technological development in the branch of artificial plasmonics
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Artificial Plasmonics for VLSI Interconnects is ideal for engineers, researchers, and scientists working in electronics, electromagnetics, and optics.
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